Steve,
        If you can get away with it without hosing up your fine pitch print,
a dual print cycle will also give you more paste into the holes.

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX  77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]

> -----Original Message-----
> From: Stephen R. Gregory [SMTP:[log in to unmask]]
> Sent: Friday, November 12, 1999 7:41 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Intrusive Reflow
>
> In a message dated 11/12/1999 3:54:06 AM Central Standard Time,
> [log in to unmask] writes:
>
> << A properly filled 40 mil hole contains more paste than a 70 mil stencil
> aperture, so please don't forget to pay attention on how to get the paste
> INTO the holes  Experiment with things like squegee speed, pressure, and
> solderpaste rheology.
>
>  Daan Terstegge >>
>
> Thanks Daan! I'll be running my squeegee speeds real slow to allow as much
> paste to roll into the holes as possible, and I'm using metal
> blades...appreciate the input!
>
> -Steve Gregory-
>
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