In a message dated 11/12/1999 3:54:06 AM Central Standard Time,
[log in to unmask] writes:

<< A properly filled 40 mil hole contains more paste than a 70 mil stencil
aperture, so please don't forget to pay attention on how to get the paste
INTO the holes  Experiment with things like squegee speed, pressure, and
solderpaste rheology.

 Daan Terstegge >>

Thanks Daan! I'll be running my squeegee speeds real slow to allow as much
paste to roll into the holes as possible, and I'm using metal
blades...appreciate the input!

-Steve Gregory-

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################