Steve,
     our experience with high volume manufacture of  intrusive reflow
products is about 3 years todate.

     The 1.0mm hole diameter is ideal on a 1.6mm thick pcb, using a 45
degree squeegee, 0.006" stencil and                maintaining a 20mm~ bead
diameter of paste behind the squeegee. The paste will just push through to
the       underside.

     My advice is to measure the underside of the part and ensure the
overprint paste does not di-sected during          insertion. (to avoid
soledr balling)

     with regards as to aperature size, ensure the outer boundries do not
contact the paste and over print about 0.010"           over the plated
area. Maintain a 0.020" gap between apertures to avoid shorts.

     Ensure the part leads are spade type and the lead protrusion is not
greater than 0.5mm for best results.

Felix

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