Hi Ingemar,
I certainly would agree that 'Design for Reliability (DfR)' is necessary, in
this case and all others, to assure adequate long-term reliability of the
solder joints. However, for chip caps "FEA and solder joint CAD simulation
tools" are unnecessary overkill. For such a simple arrangement closed-form
equations will do nicely, see IPC-D-279. The more complex the modeling, the
more assumptions, often not very well founded ones, have to be made. FEA and
CAD tools are necessary for complex structures, such as BGAs, but not for CCs.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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