Hi gang,
       We are cross-sectiong some solder joints, and are seeing some
     voiding inside the joint itself, that appears to be "air pockets" that
     were inside the joint when reflowed. There is no visible indication
     externally of any voiding, but it is fairly prevalent inside various
     component solder joints when cross-sectioned.

       I cannot find criteria or mention of this in the specifications I
     have. ANSI/IPC-A-610A shows voiding criteria for thru-hole components,
     but none for SMD.

     Does anyone have knowledge they can share on this topic? Is there a
     spec on internal SMD joint voiding available? Do you guys and gals see
     this occasionally in your joints?

     Please, enlighten me with your collective wisdoms!
     TIA!

     Jeff Hempton
     United Technologies Electronic Controls

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