Franklin:
The reason why a new supplier is suggested is because I've had experiences
where I would show the defects to the board manufacturer and he would point
the finger at my process for the cause of the problem. Then I would direct
our purchasing folks to order the next set of cards from a different vendor
and guess what.... The problem goes away. Maybe your suppliers are willing
to investigate their processes as a possible cause, if you have suppliers
like this.... keep them!
Bill Kasprzak
Moog Inc.
> -----Original Message-----
> From: Franklin [SMTP:[log in to unmask]]
> Sent: Wednesday, November 10, 1999 8:15 PM
> To: [log in to unmask]
> Subject: Re: [TN] Voids after Wave-Soldering!
>
> Curious, why do some end users make comments about finding new suppliers
> when assemblers ask questions about probable board defects?
>
> Just curious is all, consider I notice this on some e-mail replies.
>
> Thanks,
>
> Franklin
>
> ----- Original Message -----
> From: Kasprzak, Bill (esd) USX <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Wednesday, November 10, 1999 12:44 PM
> Subject: Re: [TN] Voids after Wave-Soldering!
>
>
> Paul:
>
> Anytime I've seen volcanic type voids as you have described generally
> points
> to moisture trapped inside the board near the plated thru hole. Try baking
> a
> board for a couple of hours at 225° - 250°F, then re-run. If the problem
> persists then all I can say is that there are volitiles trapped inside
> your
> PWB and nothing can be done to remove them except to talk to your board
> supplier. (or find a new one !)
>
> Bill Kasprzak
> Moog Inc.
> > -----Original Message-----
> > From: Paul Tomlinson [SMTP:[log in to unmask]]
> > Sent: Wednesday, November 10, 1999 10:57 AM
> > To: [log in to unmask]
> > Subject: [TN] Voids after Wave-Soldering!
> >
> > Hi folks,
> >
> > I am just learning about these matters, and this is THE place where
> > knowledge and experience abounds so please somebody help me with this.
> >
> >
> > I have just had my first ever boards waved and the results are not
> > encouraging. What could be the cause of a volcano shaped void between
> the
> > component leads being soldered and the main body of the solder?
> >
> >
> > There is perfect continuity, the area at the tip and that around the
> board
> > are well wetted, but mechanically the joints are very weak and prone to
> > failure, the parts can actually be pulled out of the board without being
> > damage.
> >
> >
> > Could this be simply the result of a too low temperatured wave? They
> used
> > 465F.
> >
> > | |
> > | |
> > | |
> > --------------------- | | -------------------
> > | | | |
> > | | | |
> > | | | |
> > --------------------- | | -------------------
> > * * | | * *
> > * *V | | V * *
> > * * O | | O * *
> > * * I | | I * *
> > * * D | | D * *
> > * * | | * *
> > * * | | * *
> > * *| | * *
> > * | | *
> > *| |*
> > ---------
> >
> > This ASCII art is extremely crude so I have attached both JPG and BMP
> > files
> > of a much better drawing.
> >
> > Tia,
> >
> > Paul. << File: lead.bmp >> << File: lead.jpg >> << File: ATT15807.txt
> >>
> >
>
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