Hi!
If I am right- according to the picture- you have a single sided circuit
board with solder pads on the print side. According to your drawing the pads
inner diameter is smaller than the actual hole, and you lead diameter is so,
that you have a large gap between the soldering surface of the circuit and
the lead.
I suppose that this situation is not for all components, if yes, look for
other suggestions you have got.The gap seems to be too large. I had this
situation once, with a two leaded component and we bent the leads if I
remember well. later we changed the design. Component solderability must be
checked too.
Good luck,
Gaby

> ----------
> From:         Paul Tomlinson[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Paul Tomlinson
> Sent:         ?יום רביעי 10 נובמבר 1999? 17:56
> To:   [log in to unmask]
> Subject:      [TN] Voids after Wave-Soldering!
> 
> <<File: lead.bmp>><<File: lead.jpg>><<File: ATT32500.txt>>
> Hi folks,
> 
> I am just learning about these matters, and this is THE place where
> knowledge and experience abounds so please somebody help me with this.
> 
> 
> I have just had my first ever boards waved and the results are not
> encouraging.  What could be the cause of a volcano shaped void between the
> component leads being soldered and the main body of the solder?
> 
> 
> There is perfect continuity, the area at the tip and that around the board
> are well wetted, but mechanically the joints are very weak and prone to
> failure, the parts can actually be pulled out of the board without being
> damage.
> 
> 
> Could this be simply the result of a too low temperatured wave?  They used
> 465F.
> 
>                        |       |
>                        |       |
>                        |       |
> --------------------- |       | -------------------
>                      | |       | |
>                      | |       | |
>                      | |       | |
> --------------------- |       | -------------------
>            *         * |       |  *         *
>           *         *V |       | V *         *
>            *       * O |       | O  *       *
>             *      * I |       | I  *      *
>               *    * D |       | D  *    *
>                 *   *  |       |   *   *
>                   *  * |       |  *  *
>                     * *|       | * *
>                      * |       | *
>                       *|       |*
>                        ---------
> 
> This ASCII art is extremely crude so I have attached both JPG and BMP
> files
> of a much better drawing.
> 
> Tia,
> 
> Paul.
> 

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################