Hi Bernhard,
At Bell Laboratories we found that 1812's were not suitable in
telecommunications outside plant environment from a solder joint reliability
perspective (not considering 1812's with thicker solder joints due to
gluing). CC's are susceptible to component cracking depending on the size of
the solde fillet--the larger the fillet, the more stress on the CC's. Also,
too rapid cooling from reflow can cause thermal shock stresses that are too
high.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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