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November 1999

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Subject:
From:
Teo Tijerina <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 10 Nov 1999 13:32:37 -0700
Content-Type:
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text/plain (24 lines)
I am looking for information on Chip on Board Processes:  different types,
manufacturing issues, quality issues, etc.
In particular, I am curious about chip on wire, flip chip, and chip scale
packages.

Does anybody know of any reference material?

-Teo Tijerina
915.780.5552

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