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November 1999

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Subject:
From:
"Vaughan, Ralph H" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 2 Nov 1999 06:19:52 -0800
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Tom,

I think this has been looked at from many different angles.  We had some
horrible experiences with HASL long ago that drove us to requiring
(expensive) selective solder plating for better solderability.  As our
bruises healed and HASL processes improved, we began reconsidering allowing
it, and our board shops showed us test results supporting HASL reliability.
What we did impose on the supplier, rather than a solder thickness minimum,
was an in-process solderability-after-aging test (since everything solders
well when fresh).  Like the new performance-based specs, we just tell the
shops what we want the boards  to do (solder after aging) and let them
figure the best way to achieve those results.

Ralph Vaughan
Boeing
> ----------
> From:         Tom Oliver[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Tom Oliver
> Sent:         Tuesday, November 02, 1999 6:36 AM
> To:   [log in to unmask]
> Subject:      [TN] HASL thickness spec help
>
> Good Morning
> Again I am looking for some help. We visited 4 different board shops last
> week and got some good feedback on our solderability issues.
> One of the things they stated is if the thickness of HASL drops below 50
> micron/ microinches I am not sure which, it would affect solderabilty.
> I have looked thru the IPC specs on Boards and solderability and have
> found
> nothing on the min and max thickness for the solder. We use 63/37 solder
> surface on our boards.
> We are thinking of putting a min thickness spec on our B/P's is this
> feasible or not. Also what is the standard that relates to this or the
> industry standard that is used?
> Thanks in advance
>
> Tom Oliver
> QC Supervisor
> Eagle Comtronics
> [log in to unmask]
>
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