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November 1999

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Subject:
From:
Alain Savard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 10 Nov 1999 12:27:03 -0500
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Paul,

A few things to look at:
- How is the copper plating inside the component hole?
- How is the Preheat on the wave?
- How much of a heat sink does the board design present?
- What type of flux are you using?
- Does the flux used have time to actually work the surface?
- Did you do a solderability test on the coupon of the bare board?
- Did you do a solderability test on some of the components?

After answering a few of these questions it might be easier to help,
but the wave temperature may be a bit low, especially if the preheat
is not sufficient.


Alain Savard, B.Sc.
Chemical Process Analyst
CAE Electronics Ltd.
e-mail: [log in to unmask]

-----Original Message-----
From: Paul Tomlinson [mailto:[log in to unmask]]

I am just learning about these matters, and this is THE place where
knowledge and experience abounds so please somebody help me with this.

I have just had my first ever boards waved and the results are not
encouraging.  What could be the cause of a volcano shaped void between the
component leads being soldered and the main body of the solder?

There is perfect continuity, the area at the tip and that around the board
are well wetted, but mechanically the joints are very weak and prone to
failure, the parts can actually be pulled out of the board without being
damage.


Could this be simply the result of a too low temperatured wave?  They used
465F.

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