Hi folks,

I am just learning about these matters, and this is THE place where
knowledge and experience abounds so please somebody help me with this.


I have just had my first ever boards waved and the results are not
encouraging.  What could be the cause of a volcano shaped void between the
component leads being soldered and the main body of the solder?


There is perfect continuity, the area at the tip and that around the board
are well wetted, but mechanically the joints are very weak and prone to
failure, the parts can actually be pulled out of the board without being
damage.


Could this be simply the result of a too low temperatured wave?  They used
465F.

                       |       |
                       |       |
                       |       |
--------------------- |       | -------------------
                     | |       | |
                     | |       | |
                     | |       | |
--------------------- |       | -------------------
           *         * |       |  *         *
          *         *V |       | V *         *
           *       * O |       | O  *       *
            *      * I |       | I  *      *
              *    * D |       | D  *    *
                *   *  |       |   *   *
                  *  * |       |  *  *
                    * *|       | * *
                     * |       | *
                      *|       |*
                       ---------

This ASCII art is extremely crude so I have attached both JPG and BMP files
of a much better drawing.

Tia,

Paul.




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