I'm currently working on a multichip module which will solder to a flex. it's
very likely that we're going to come up with a rather esoteric pad pattern and
shape for the joints between the MCM and PWB.

I'm sure IPC has some document which outlines suitable test procedures for
qualifying a new pad design, but for the life of me I can't find it. Can anyone
quote me an IPC spec number. Failing that I'd be interested in anything
published by anyone else. The particular application goes in a piece of hand
held consumer electronics.

Thanks,



Eric Christison

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