Hi John,

We use the stencil thickness as the lower control limit. Upper limit is set to stencilthickness + 100 micron. 
If the variation of boards is limited (topography of the board is what matters here) you should be able to set your limits a little tighter, but even for high-quality products that isn't really necessary. 
I like the LSM very much. We have it here for about five years, and never had a problem with it.

Daan Terstegge
Unclassified mail

>>> John Harris <[log in to unmask]> 11/08 11:14 pm >>>
Guys,

We have just got ourselves a nice LSM Solder paste height unit. I was
wondering what typical control limits you guys have in relation to the
stencil thickness. Some tests that were done here some years ago had the
lower control limit as [stencil thickness - 15%]. Would that be reasonable?
What about the upper limit?

Thanks

John Harris
Process Engineer
AEMS Pty Ltd

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