I've peeked at this site and found it contained about 4 articles written by
IPC.  The ones I inspected seemed as rah-rah articles, you know the kind
that go into trade magazines.  I'm hoping something significant will get
there, but I don't think its worth the look yet.  When it does, I hope it
gets
interesting...

Carey
-----Original Message-----
From: Goldman, Patricia J. <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Monday, November 08, 1999 10:14 AM
Subject: Re: [TN] Lead issues


>Jack,
>In addition, can we assume the Proceedings from the Fall IPCWorks on "Get
>the lead out" will be available sometime in the near future?
>
>Patty
>Patricia J. Goldman
>PPG Industries, Inc.
>412-492-5516
>[log in to unmask]
>
>
>-----Original Message-----
>From: Jack Crawford [mailto:[log in to unmask]]
>Sent: Monday, November 08, 1999 11:32 AM
>To: [log in to unmask]
>Subject: Re: [TN] Lead issues
>
>
>For Ed and others "catching up"--
>
>IPC is now sponsoring a web site specific to lead reduction work.
>www.leadfree.org
>
>You'll see info on subscribing to the leadfree forum there, as well as
>access to the message archives.  LOTS of good discusion and info there!
>jack
>
>>>> Ed Cosper <[log in to unmask]> 11/08/99 10:12AM >>>
>Hi all,
>
>I think I've fallen behind on the lead issue. So perhaps some of you can
>update me a little. I am aware of the environmental ( mostly from Europe )
>push to "get the lead out".  I've been watching this with quite some
>interest as to what board shops are doing and looking into to eliminate the
>HASL process. However, a recent question was posed to me that I simply
>couldn't answer.  What is proposed to eliminate the tin/lead at the
assembly
>soldering process? You have to mount ( solder ) all these SMTs and BGAs to
>the boards with something. I suspect the volume of tin/lead in the
aggregate
>solder joints is significantly higher that what was on the delivered bare
>board.
>
>
>Just curious,
>
>Ed Cosper
>ABC
>
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