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November 1999

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 8 Nov 1999 10:32:00 -0600
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For Ed and others "catching up"--

IPC is now sponsoring a web site specific to lead reduction work.  www.leadfree.org 

You'll see info on subscribing to the leadfree forum there, as well as access to the message archives.  LOTS of good discusion and info there!  jack

>>> Ed Cosper <[log in to unmask]> 11/08/99 10:12AM >>>
Hi all,

I think I've fallen behind on the lead issue. So perhaps some of you can update me a little. I am aware of the environmental ( mostly from Europe ) push to "get the lead out".  I've been watching this with quite some interest as to what board shops are doing and looking into to eliminate the HASL process. However, a recent question was posed to me that I simply couldn't answer.  What is proposed to eliminate the tin/lead at the assembly soldering process? You have to mount ( solder ) all these SMTs and BGAs to the boards with something. I suspect the volume of tin/lead in the aggregate solder joints is significantly higher that what was on the delivered bare board. 


Just curious,

Ed Cosper
ABC

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