Jeff,
We did some studies on this when I was at McDonnell-Douglas several years
ago. We never did identify the root cause for voids in SMT joints, because
we focused primarily on reliability. As I remember, we found no reliability
degradation with voids that were up to approximately 25% of the solder joint
volume. I could dig through lot of boxes and maybe retrieve some old
reports on the matter.
Jon Moore
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