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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 11 Nov 1999 15:48:03 -0500 |
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Steve, look at www.amp.com/products/technology/articles/dd66c.stm
Jim Marsico
-----Original Message-----
From: Stephen R. Gregory [SMTP:[log in to unmask]]
Sent: Thursday, November 11, 1999 2:52 PM
To: [log in to unmask]
Subject: [TN] Intrusive Reflow
Hi ya'll!
I'm getting ready to do some intrusive reflow on this board we got
here...(this is my first time! I'm s-o-o-o nervous...not
really...well, maybe
a little...hehehe) Anyways,
the parts are going to be 2, 20-pin SIP sockets. The board is .063"
thick,
the holes
are spaced .100" apart, and the hole diameter is .040". I'm trying
to decide
how big I should make my apertures.
I've looked at all the archive postings (there are a 168 of them on
intrusive
reflow) to see if anybody posted any recommended stencil
thicknesses, and/or
aperture sizes,
but there was none. I looked on the web, but couldn't find any real
guidelines either...
(hmmmm, something I couldn't find...now THAT's a change!)
I need to keep my stencil thickness at 6-mils, 'cause I've got some
20-mil
pitch stuff on the same side. I was thinking of doing .060-.070"
diameter
circles over the holes...
does that sound okie-dokie?
I did a little test with the SIP socket and a syringe full of solder
paste. I
drew a bead of paste (about .030" dia.) down the row of holes and
dropped the
connector in, then reflowed it. Then I got my dremel tool out and
did me a
rough cross section to check the barrel fill. It actually wasn't too
bad...there were about 2-3 holes that were a little shy volume-wise
but that
was because (I think) the solder wicked over to the holes next to it
because
of the continuous bead of paste I had laid down. That shoudn't
happen when I
have individual deposits of paste for each hole.
So how big should I make my openings? Did I guess right at
.060-.070"?
-Steve Gregory-
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