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November 1999

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Subject:
From:
"Kasprzak, Bill (esd) USX" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 11 Nov 1999 08:19:38 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (154 lines)
Franklin:

The reason why a new supplier is suggested is because I've had experiences
where I would show the defects to the board manufacturer and he would point
the finger at my process for the cause of the problem. Then I would direct
our purchasing folks to order the next set of cards from a different vendor
and guess what.... The problem goes away. Maybe your suppliers are willing
to investigate their processes as a possible cause, if you have suppliers
like this.... keep them!

Bill Kasprzak
Moog Inc.
> -----Original Message-----
> From: Franklin [SMTP:[log in to unmask]]
> Sent: Wednesday, November 10, 1999 8:15 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] Voids after Wave-Soldering!
> 
> Curious, why do some end users make comments about finding new suppliers
> when assemblers ask questions about probable board defects?
> 
> Just curious is all, consider I notice this on some e-mail replies.
> 
> Thanks,
> 
> Franklin
> 
> ----- Original Message -----
> From: Kasprzak, Bill (esd) USX <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Wednesday, November 10, 1999 12:44 PM
> Subject: Re: [TN] Voids after Wave-Soldering!
> 
> 
> Paul:
> 
> Anytime I've seen volcanic type voids as you have described generally
> points
> to moisture trapped inside the board near the plated thru hole. Try baking
> a
> board for a couple of hours at 225° - 250°F, then re-run. If the problem
> persists then all I can say is that there are volitiles trapped inside
> your
> PWB and nothing can be done to remove them except to talk to your board
> supplier. (or find a new one !)
> 
> Bill Kasprzak
> Moog Inc.
> > -----Original Message-----
> > From: Paul Tomlinson [SMTP:[log in to unmask]]
> > Sent: Wednesday, November 10, 1999 10:57 AM
> > To:   [log in to unmask]
> > Subject:      [TN] Voids after Wave-Soldering!
> >
> > Hi folks,
> >
> > I am just learning about these matters, and this is THE place where
> > knowledge and experience abounds so please somebody help me with this.
> >
> >
> > I have just had my first ever boards waved and the results are not
> > encouraging.  What could be the cause of a volcano shaped void between
> the
> > component leads being soldered and the main body of the solder?
> >
> >
> > There is perfect continuity, the area at the tip and that around the
> board
> > are well wetted, but mechanically the joints are very weak and prone to
> > failure, the parts can actually be pulled out of the board without being
> > damage.
> >
> >
> > Could this be simply the result of a too low temperatured wave?  They
> used
> > 465F.
> >
> >                        |       |
> >                        |       |
> >                        |       |
> > --------------------- |       | -------------------
> >                      | |       | |
> >                      | |       | |
> >                      | |       | |
> > --------------------- |       | -------------------
> >            *         * |       |  *         *
> >           *         *V |       | V *         *
> >            *       * O |       | O  *       *
> >             *      * I |       | I  *      *
> >               *    * D |       | D  *    *
> >                 *   *  |       |   *   *
> >                   *  * |       |  *  *
> >                     * *|       | * *
> >                      * |       | *
> >                       *|       |*
> >                        ---------
> >
> > This ASCII art is extremely crude so I have attached both JPG and BMP
> > files
> > of a much better drawing.
> >
> > Tia,
> >
> > Paul. << File: lead.bmp >>  << File: lead.jpg >>  << File: ATT15807.txt
> >>
> >
> 
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