LEADFREE Archives

November 1999

Leadfree@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Wanner Bernhard <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Wed, 17 Nov 1999 10:11:33 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines)
Erik, some years back I've used your report 61/88EN "Reliability of Soldered
Joints; a description of the state of the art" (1988) to learn about factors
with influence to the solder joint reliability. Now I would like to read a
similar lead-free report. is there a reliability report of lead-free
soldered joints or do you intend to write such one? Beside this I would be
also interest to see parctical examples of repair management, this means
what kinds of new, lead-free solder alloys can be used to repair older
(lead-tin) field-returns?
Bernhard

################################################################
Leadfree E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask]
with following text in the body:
To subscribe:   SUBSCRIBE Leadfree <your full name>
To unsubscribe:   SIGNOFF Leadfree
################################################################
IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
Assemblies.
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.leadfree.org ) for additional information.
For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
################################################################

ATOM RSS1 RSS2