In a message dated 11/16/99 12:51:09, [log in to unmask] writes:
>This is just a reminder that the IDEALS project found that satisfactory 
joints
>(inspectable and reliable) were made using SnAg3.8Cu0.7 solder at a peak 
reflow
>temperature on the joint of 225°C.
Hi James,
Solder joints by themselves are neither reliable nor unreliable--they may 
however be of good quality (good wetting) or not (inadequate wetting). The 
reliability of solder joints depends on the cyclic loading conditions imposed 
and the resulting fatigue life. Thus, without doing accelerated reliability 
tests or a reliability analysis for solders of known fatigue characteristics, 
one can not call solder joint "reliable".
And on the necessary peak reflow temperature of 260C for Pb-free solders, 
Erik de Kluizenaar is absolutley right.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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