In message <[log in to unmask]>, James
Canner <[log in to unmask]> writes
>We are really at a loss to decide how to attach leads to ceramic capacitors
>for use with no lead solders such Sn-Ag-Cu for this reason.  There is no
>suitable higher melting point solder that we can find.  Are there any
>suggestions?  We currently can use 90Pb/10 Sn alloy, but lead free choice
>seems to have over 20 % Gold.

James,

This is one of (at least) two areas where a higher melting point lead-
free solder is needed, the other being bump attachment of chips inside
IC packages. Are there others?

If you can stand the temperature, you might consider a Cu-Sn-Ni-P alloy
melting at about 600C (1100F) with a 10C melting range. It is available
as paste or solid.

If this is too hot you might find that a zinc based alloy would work.
This, though, would probably need a fairly agressive flux, which you
might not like.

--
Roger Bilham
Roger Bilham Consultancy
Tel: 0181 467 8819
Fax: 08700 548 613

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