Hmm , Cheng, could we elaborate on this one please ;
if this would indeed be so ; I have a problem here ;
with legions of fellows on same pastures .

Where did you get the drift of the "phasing out 0805's" ?

402's on bottom are relatively easy due to minimal shadowing, check :
http://www.ITM-SMT.COM ; I think Phil did some work on this subject .

To be frank standard pads (manufacturer's recommendation )should do,
if you'd not stack too close or shadow from big components , but you know
that.
If you do fine on 603's , you'll have no problem on 402's ;
apart from keeping the glue from spreading to pads :
you'll start to feel the pitch on stencil or needle .

Paul Klasek
http://www.resmed.com

-----Original Message-----
From: Wm Cheng [mailto:[log in to unmask]]
Sent: Wednesday, 24 November 1999 20:34
To: [log in to unmask]
Subject: [TN] 0402


     Hi Technetters,

     It seems the market is phasing out the 1206 and 0805 chips, we also
     use the 0603 for wave soldering and the result is OK, but is there
     anyone using the 0402 chips for wave soldering process? Any suggestion
     on the footprint and process setup to accommodate for that?

     Thanks and regards,
     Cheng

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