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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 2 Nov 1999 13:32:33 -0600 |
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Hi Louis! Take a look at ANSIJ-STD-003 specification or the ANSIJ-STD-003A
interm final draft specification. The document contains a number of test methods
that can be used.
Dave Hillman
Rockwell Collins
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Louis Hart <[log in to unmask]> on 11/02/99 09:59:45 AM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
Louis Hart <[log in to unmask]>
To: [log in to unmask]
cc:
Subject: [TN] Solderability Measurement
Technetters, good morning, you may have seen my recent post on the importance of
good measurements. I need a measuring technique.
Our sister PC (I work in assembly) fab shop is introducing a new process. I
want to make sure the boards it gives us, and our own processing, produce good
solder joints - surface mount, in particular. Any ideas or experience on
quantifying solderability or a good solder joint? Microresistance, shear or
pull strength, something to be seen in a cross-section? Any ideas or comments
would be gratefully received.
Louis Hart, Quality Manager
Compunetix Instrumentation Systems Division
412-858-6184
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