Jack,
In addition, can we assume the Proceedings from the Fall IPCWorks on "Get
the lead out" will be available sometime in the near future?

Patty
Patricia J. Goldman
PPG Industries, Inc.
412-492-5516
[log in to unmask]


-----Original Message-----
From: Jack Crawford [mailto:[log in to unmask]]
Sent: Monday, November 08, 1999 11:32 AM
To: [log in to unmask]
Subject: Re: [TN] Lead issues


For Ed and others "catching up"--

IPC is now sponsoring a web site specific to lead reduction work.
www.leadfree.org

You'll see info on subscribing to the leadfree forum there, as well as
access to the message archives.  LOTS of good discusion and info there!
jack

>>> Ed Cosper <[log in to unmask]> 11/08/99 10:12AM >>>
Hi all,

I think I've fallen behind on the lead issue. So perhaps some of you can
update me a little. I am aware of the environmental ( mostly from Europe )
push to "get the lead out".  I've been watching this with quite some
interest as to what board shops are doing and looking into to eliminate the
HASL process. However, a recent question was posed to me that I simply
couldn't answer.  What is proposed to eliminate the tin/lead at the assembly
soldering process? You have to mount ( solder ) all these SMTs and BGAs to
the boards with something. I suspect the volume of tin/lead in the aggregate
solder joints is significantly higher that what was on the delivered bare
board.


Just curious,

Ed Cosper
ABC

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