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Wed, 3 Nov 1999 16:36:55 EST |
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Hi Dean,
On the copper foil, you can not directly measure 'true fracture ductility'
nor 'percent reduction in area'; it is for this reason that ASTM E 796,
"Standard Test Method for Ductility Testing of Metallic Foil," was developed.
Plated copper has even less of a true elastic behavior that rolled copper; as
a consequence, the 'modulus of elasticity' needs to be determined using an
interrupted tensile test.
From your wish list, it is obvious that you are working on the reliability of
PTH/PTV interconnect structures; most likely the ITRI project. A fatigue
reliability model does exist for copper foils covering both LCF and HCF. For
PTH/PTV barrel reliability an empirical model does exist; none does as yet
exist for innerplane separation (post separation plus).
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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