Content-Type: |
text/plain; charset="iso-8859-1" |
Sender: |
|
Subject: |
|
From: |
|
Date: |
Tue, 30 Nov 1999 08:43:10 -0000 |
MIME-Version: |
1.0 |
X-To: |
|
Reply-To: |
|
Parts/Attachments: |
|
|
Yes, thanks for the response. Yes, I'm referring to the entire surface
particularly with regard to fine tracking on outer layers.
Regards
Edward Brunker
-----Original Message-----
From: Ed Cosper [mailto:[log in to unmask]]
Sent: Monday, November 29, 1999 2:39 PM
To: [log in to unmask]
Subject: Re: [TN] BLIND VIA FAB:
Are you referring to double plating the entire external surface???
Ed Cosper
ABC
----- Original Message -----
From: Brunker Ed <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, November 25, 1999 3:52 AM
Subject: [TN] BLIND VIA FAB:
> When fabricating PCBs with blind vias, are there any alternatives to
double
> plating the outer layers? What design for manufacturability issues are
there
> regarding this technology?
> Regards
> Edward Brunker
> Principal Process Engineer
> Sendo
> Centrelink House
> Small Heath Business Park
> B10 0HJ
> UK
>
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in
> the body:
> To subscribe: SUBSCRIBE TECHNET <your full name>
> To unsubscribe: SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
> information.
> If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
> 847-509-9700 ext.5365
> ##############################################################
>
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################
|
|
|