TECHNET Archives

November 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
[log in to unmask]
Date:
Mon, 29 Nov 1999 14:14:01 EST
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Subject:
Re: Gold plating specifications
MIME-Version:
1.0
Content-Transfer-Encoding:
7bit
Content-Type:
text/plain; charset="us-ascii"
From:
Mordechai Holtzman <[log in to unmask]>
Parts/Attachments:
text/plain (24 lines) 
Hi everyone
I cannot really  recommend whet thickens to plat the gold but did any of you
consider the advantages of using Complex Wave Form- Pulse it will narrow the
difference in the thickens and also will reduce the grain size giving a
better Physical properties and savings in gold consumption. If any of you
gentlemen would like to get more information please write to me and I would
reply as soon as I can
all my Best
Moti Holtzman

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2