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Thanks Cheng , perhaps we have to crystal ball 2001 after all .
Could anybody else verify the 805's slide to history please ?
Paul Klasek
ResMed
PS
Found the algorithm library finally,
if any of you attempt standardize automation as well :
http://hissa.ncsl.nist.gov/~black/CRCDict/terms.html
-----Original Message-----
From: Wm Cheng [mailto:[log in to unmask]]
Sent: Thursday, 25 November 1999 1:18
To: [log in to unmask]
Subject: Re: [TN] 0402
Hi Paul, I was told by our purchasing guy that Rohm will phase out
their 1206 and 0805 capacitors, they also said this is the trend for
Japanese and Taiwanese vendor to go for smaller chips size.
Thanks,
Cheng
______________________________ Reply Separator
_________________________________
Subject: RE: [TN] 0402
Author: Paul Klasek <[log in to unmask]> at Internet
Date: 11/24/99 4:06 PM
Hmm , Cheng, could we elaborate on this one please ;
if this would indeed be so ; I have a problem here ;
with legions of fellows on same pastures .
Where did you get the drift of the "phasing out 0805's" ?
402's on bottom are relatively easy due to minimal shadowing, check :
http://www.ITM-SMT.COM ; I think Phil did some work on this subject .
To be frank standard pads (manufacturer's recommendation )should do,
if you'd not stack too close or shadow from big components , but you know
that.
If you do fine on 603's , you'll have no problem on 402's ;
apart from keeping the glue from spreading to pads :
you'll start to feel the pitch on stencil or needle .
Paul Klasek
http://www.resmed.com
-----Original Message-----
From: Wm Cheng [mailto:[log in to unmask]]
Sent: Wednesday, 24 November 1999 20:34
To: [log in to unmask]
Subject: [TN] 0402
Hi Technetters,
It seems the market is phasing out the 1206 and 0805 chips, we also use
the 0603 for wave soldering and the result is OK, but is there anyone
using the 0402 chips for wave soldering process? Any suggestion on the
footprint and process setup to accommodate for that?
Thanks and regards,
Cheng
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