TECHNET Archives

November 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Transfer-Encoding:
7bit
Sender:
TechNet <[log in to unmask]>
Subject:
Copper cleaning
From:
"Scott B. Westheimer" <[log in to unmask]>
Date:
Thu, 18 Nov 1999 08:43:37 +0800
Content-Type:
text/plain; charset="iso-8859-1"
MIME-Version:
1.0
Reply-To:
[log in to unmask]
Parts/Attachments:
text/plain (23 lines) 
I am looking for the procedure for checking the copper surface after LPI
pre-cleaning. I thought that there was an IPC test method to check for any
residues on the copper surface after cleaning and before LPI. Does anyone
have a test method. Also would be interested in knowing what type of
cleaning procedures people use prior to LPI screening. We have a serious
problem with oxidation after cleaning and before screening LPI.

Thanks

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2