IPC is exploring the membership interest in a new service to translate trade journal articles from Japanese technical journals into English.  In order to judge the member interest, IPC has selected to translate two articles from the Journal of the Japan Institute of Electronics Packaging.  These articles are entitled:

-- Influence of Lift-Off on Reliability of Lead-Free Soldering by Matsushita Electronics Semiconductor Company

-- Effect of Cu-cored Balls in Solder Balls on Microstructure and Strength of BGA Joints by Osaka University, IBM and Sumitomo Metals

If you are interested in reviewing these translations and are willing to complete a brief survey, please send your contact information including name, company, address, and e-mail to:
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We will send the articles and the survey to your attention.

Thanks for your interest.
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David W. Bergman, CAE
Vice President Standards, Technology & International Relations
847-790-5340 Phone  847-509-9798 Fax
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