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November 1999

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TechNet <[log in to unmask]>
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David Whalley <[log in to unmask]>
Date:
Thu, 11 Nov 1999 11:15:19 +0100
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Guenter Grossmann <[log in to unmask]>
Subject:
Re: 1812 capacitors on FR-4(Lead Free )
From:
Guenter Grossmann <[log in to unmask]>
In-Reply-To:
<[log in to unmask]>
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text/plain (32 lines) 
David
Yes you are right. One of the problems that will arise when using lead free
solder is the cracking of ceramic chip components. However, also lead free
solder creeps. This means, the stress occurring in the component does not
only depend on the temperature range but also on the temperature ramp.
However, I don't have any data.

Best regards

Guenter



Guenter Grossmann
Swiss Federal Institute for Materials Research  and Testing
8600 Duebendorf
Switzerland

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