I'm currently working on a multichip module which will solder to a flex. it's
very likely that we're going to come up with a rather esoteric pad pattern and
shape for the joints between the MCM and PWB.
I'm sure IPC has some document which outlines suitable test procedures for
qualifying a new pad design, but for the life of me I can't find it. Can anyone
quote me an IPC spec number. Failing that I'd be interested in anything
published by anyone else. The particular application goes in a piece of hand
held consumer electronics.
Thanks,
Eric Christison
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################