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November 1999

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Sender:	DesignerCouncil <[log in to unmask]>
X-To:	Greg Bordash <[log in to unmask]>
Date:	Mon, 15 Nov 1999 11:21:04 -0800
Reply-To:	"DesignerCouncil E-Mail Forum." <[log in to unmask]>, Abd ul-Rahman Lomax <[log in to unmask]>
Subject:	Re: Calculating thermal dissipation of external plane heat sink area
From:	Abd ul-Rahman Lomax <[log in to unmask]>
In-Reply-To:	<[log in to unmask] om>
Content-Type:	text/plain; charset="us-ascii"
Parts/Attachments:	text/plain (14 lines)

At 11:04 AM 11/15/99 -0500, Greg Bordash wrote:
>We are in the process of using an external (Primary or Secondary) layer heat
>sink plane for a regulator type device on a multi layer design and require a
>means of calculating the required area based on its power requirements.

Just a suggestion: if a heat sink plane has many large open plated-through
holes in it, it can be *much* more effective, probably due to increased
surface area as well as convective cooling due to air flow through the holes.

[log in to unmask]
Abdulrahman Lomax
P.O. Box 690
El Verano, CA 95433

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