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October 1999

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Subject:
From:
Craig Ropp <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 29 Oct 1999 17:32:13 -0500
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¯-----------"Help"!!!!
We instituted a baking step before Post Etch Punch approximately 1 year ago. This was done (I am told) because we had just started using the PEP machine as part of an overall tooling upgrade. The bake was added because there was concern that there may be some moisture absorption at the Etch process which would have impact dimensionally in conjunction with the dimensional effects we typically see from Etch. The PEP is a CA Picard machine which punches 4 slotted tooling holes in the innerlayers. These tooling holes are supposed to allow for  self-centering so that at press the innerlayer can move without building up stress. This innerlayer then goes through the Oxide line and receives another Bake before Press. 
We now have acquired a Barco AOI and are experiencing difficulty because the bake  before PEP darkens the copper and makes it harder to inspect. The Production Folks want to drop this Bake Step. MY QUESTION IS: What is the risk in doing this? If I've learned one thing in the Printed Wiring Board Business It's not to make changes lightly.  And if you do make a change watch it like a hawk! Your input would be appreciated. 
Thanks,  Craig 

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