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October 1999

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Subject:
Re: Board Delamination . . . RT
From:
Chris Evans <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 29 Oct 1999 08:10:08 +0100
Content-Type:
multipart/alternative
Parts/Attachments:
BDY.RTF (160 bytes) , BDY.RTF (486 bytes) 
Gaby

Intermetalic formation at the copper / tin lead interface is dependant
on temperature. Having something in a vacumm will not reduce it.

Regards

Chris Evans
MBD UK

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