Hello fellow technetters:
Is there a library that addresses pad profile recommendations for wave soldered
BSMT components? What factors influence solder defects (Solder balls, Bridging,
Insufficient solder, etc. on trying to wave solder these BSMT's? Will be running
a DOE and I would like to see what factors I would need to consider (Solder
speed at exit from wave solder, how close the board is to the wave, temperature
profile, etc.)
Any and all answers are greatly appreciated
Ivan Barrios

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