Hello Technet...

Is anyone familiar with Kyocera's "Dimpled" BGA packages?  Well, let me
explain...  Prior to balling, these ceramic packages have the metalized
terminations on the bottom which are recessed 8 mils below the surface, thus, a
dimple.  Since we are installing the balls here in our facility, I'd like to
ensure myself that the terminations are solderable.  (You see, we are
purchasing the empty packages from Kyocera and building an MCM.  The packages
go through numerous heat cycles during die attachment and burn-in, especially
if the component needs to be reworked.)  I need to develop a solderability test
for these devices.  Any suggestions?

Thanks in advance...

Jim Marsico
AIL Systems Inc.
(516) 595-5879
[log in to unmask]


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