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October 1999

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Subject:
From:
Alain Savard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 26 Oct 1999 12:33:06 -0400
Content-Type:
text/plain
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text/plain (44 lines)
I do not suggest a high temperature baking, but I've heard of some
people baking to Tg temperature or higher. It is bad for the board,
I just wanted to point it out.

Alain Savard, B.Sc.
Chemical Process Analyst
CAE Electronics Ltd.
e-mail: [log in to unmask]

-----Original Message-----
From: Howieson, Rick [mailto:[log in to unmask]]

The purpose of baking is to remove moisture. I don't think you need to
bake at the glass transition of the laminate. I have mentioned common
sense in the TrainerNET forum and it certainly can be applied in this
forum.
Bueno, Bye
Rick Howieson

>-----Original Message-----
>From:  Alain Savard [SMTP:[log in to unmask]]

>It increases cross linking inside the epoxy of the laminate,
>making is slightly more brittle and harder every time you
>bake it. It alsoi ncreases the speed of tin oxide formation,
>in effect it ages the board.
>
>It has also been suggested that a high temperature bake
>(> Tg) may cause warpage in a pressed board.

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