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October 1999

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Subject:
From:
Massey Roger-G14195 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 26 Oct 1999 13:14:57 +0100
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Hi Terri,

        A possible alternative to Charles's suggestion, (and his would
probably be the preffered route), would be to consider something like Pd
(3-12uin )over EN(50-100uin) with Au flash, this is "potentially" an
expensive option, but has been succesfully used as a wire bondable and
solderable metallurgy. You will need to re-evaluate your wire bond process
for Pd, and also you would expect a shorter capillary life due to the high
hardness of Pd. One word of warning though, the Pd is real thin, and needs
to be handled real careful to avoid scratches etc. If going to a Pd finish,
its a pretty big undertaking, but it is an option, and has been used in
volume manufacture

                Good luck
                    Roger

Roger Massey
Materials Technologist
Motorola AIEG
UK

-----Original Message-----
From: Houston, Terri [mailto:[log in to unmask]]
Sent: 26 October 1999 06:19
To: [log in to unmask]
Subject: [TN] Board finish for BGAs and wirebonds


Hi,
  We're designing boards that will use both solderable (BGA and QFP)
components and wirebonded die (that need gold bond pads). It also looks like
the QFPs will be on the backside of the board in the "shadow" of the BGA
topside component.

   I would appreciate any advice on:
         (1) recommended surface finish on the board
         (2) component placement guidelines

Thanks,
Terri

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