Hi,
  We're designing boards that will use both solderable (BGA and QFP)
components and wirebonded die (that need gold bond pads). It also looks like
the QFPs will be on the backside of the board in the "shadow" of the BGA
topside component.

   I would appreciate any advice on:
         (1) recommended surface finish on the board
         (2) component placement guidelines

Thanks,
Terri

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