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October 1999

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Subject:
Immersion Silver in lieu of immersion tin
From:
"Vandendolder, Ron" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 25 Oct 1999 10:36:43 -0400
Content-Type:
text/plain
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text/plain (29 lines) 
We are currently using immersion silver on some of our millimeter wave
assemblies and are exploring the prospect of specifying
Alpha Metals Immersion Silver as an acceptable alternative.  The product is
called AlphaLEVEL and purportedly shows good solderability and reliability
results for SMT and through-hole assembly without any modifications to the
assembly process used for tin.

Our interest is also peaked by the prospect of being able to perform gold
wire bonding directly to the silver finish.

Ron VandenDolder
Operations Manager
Telaxis Corporation
SouthDeerfield, MA.

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