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October 1999

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Subject:
From:
Alain Savard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 22 Oct 1999 08:59:35 -0400
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Distance of the air knife to the board is also a factor.

Alain Savard, B.Sc.
Chemical Process Analyst
CAE Electronics Ltd.
e-mail: [log in to unmask]

-----Original Message-----
From: Scott A. Bowles [mailto:[log in to unmask]]

Settings will vary by machine and also by the type of product you are=20
running, i.e. board thickness, rigid or flex, etc.  Also the distance =
from=20
the air knives to the board surface is important.  Try some of these =
ranges=20
to get you started:

Solder pot temperature: 240=B0 - 250=B0C    (465=B0 - 480=B0F)
Air knife temperature   250=B0C
Air knife pressure      30 - 40 foot lbs/in2   =20
Dwell time              2 -3 seconds
Insert / Withdraw       20 - 22 inches/sec

Scott A. Bowles

In a message dated 10/21/99 6:51:05 AM !!!First Boot!!!, =
[log in to unmask]
writes:

<< We are using a Taiwanese HASL machine and we are having a lot of =
problems
 with solder thickness distribution. Can anyone give me some guide =
lines
 regarding air knife temperature, extraction speed, dwell time etc.
  >>

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