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October 1999

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Subject:
From:
Sherry Goodell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 21 Oct 1999 18:01:53 -0400
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Hi Scott,

The questions you pose are very much product and process dependant.

Without more detail as to the type of problem you are seeing it would not be
possible to trouble-shoot this here.  Are we talking about solder thickness
within one pad?  Solder thickness from pad to pad within one feature size?
Or is this a coplanarity requirement over the entire panel?

Are you using XRF for your thickness measurement?  If so, can you tell us
where and how you are measuring and grouping the data?  What is the
specification you are trying to achieve?  What numbers are you getting?

There is some general information an capability down loadable in the tech
libraries at the following 2 sites that may help you some,www.huggroup.org,
www.tet-halco.com.

Ultimately,   Your equipment msupplier should be able to help with the set
up information to achieve the best results for their equipment.  Please keep
in mind that all HAL equipment is not equal and there could be some
limitations on the capability of your equipment.  Your best source of
information should be your Equipment Manufacturer.

If I can be of further assistance please do not hessitate to contact me on
or off line.

Best regards,
Sherry




> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Scott B. Westheimer
> Sent: Thursday, October 21, 1999 6:00 PM
> To: [log in to unmask]
> Subject: [TN] HASL
>
>
> We are using a Taiwanese HASL machine and we are having a lot of problems
> with solder thickness distribution. Can anyone give me some guide lines
> regarding air knife temperature, extraction speed, dwell time etc.
>
> Thanks
>
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