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October 1999

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Subject:
From:
Larry Tawyea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 21 Oct 1999 10:01:11 EDT
Content-Type:
text/plain
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text/plain (39 lines)
Eric,

If you took a survey of everyone using electroless Ni./immersion Au., I
assume this is what you are using in the UK, 50% would say that it is fine
and 50% would say they are having solderability problems with this plating.
Some of the options that I am familiar with and should give you better
solderability are as follows;

HASL over CU, although you may have problems with thickness variations on a
micro BGA.

Immersion tin over copper, remember though that the liquidus temperature of
tin is 231C.  Eliminates the problem with HASL on thickness variations.

Electrolytic tin over copper is very solderable.  More so if it is fused to
the copper.

For high rel applications, electrolytic tin over electrolytic Ni. is also
very solderable.

Also for high rel applications an experimental plating of immersion tin over
electrolytic Ni would be very solderable.

Larry

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