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October 1999

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Subject:
From:
Alain Savard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 21 Oct 1999 07:30:23 -0400
Content-Type:
text/plain
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text/plain (56 lines)
There are probably as many ways to properly etch as there are people doing
it.
We use a fresh solution (less then 8 hours old, more then 5 minutes) of:
   - 10 mL DI water
   - 15 mL Ammonia (28%)
   - 8 mL  Hydrogen peroxide (35%)

The most important part was mentioned in the first part of Timothy's
message.

" look for the separation  _BEFORE_ etching"

Alain Savard, B.Sc.
Chemical Process Analyst
CAE Electronics Ltd.
e-mail: [log in to unmask]

-----Original Message-----

I would recommend looking for the separation  _before_ etching the
microsection. We use an etchant solution of 15 mL 30% ammonia solution, 1 mL
30% hydrogen peroxide, water to make 100 mL. Leave it on for no longer than
5 seconds then rinse it off.
Make it fresh daily, and be careful with the peroxide, it will burn your
skin.

Timothy Reeves

> ----------
> From:         Howard Lin

>  I want to use microsection to check interconection defect (ICD). But I
> have
> no standard procedure to verify this defect. Should I use microetching on
> microsection coupon? Will microetching cause confuse between ICD and
> normal
> interface between electro'less copper and inner layer copper? Is there any
> standard procedure to do microetching? Any input I will be very
> appreciated.
>
> Howard Lin

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