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October 1999

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Subject:
From:
Timothy Reeves <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 20 Oct 1999 16:48:06 -0700
Content-Type:
text/plain
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text/plain (48 lines)
I would recommend looking for the separation  _before_ etching the
microsection. We use an etchant solution of 15 mL 30% ammonia solution, 1 mL
30% hydrogen peroxide, water to make 100 mL. Leave it on for no longer than
5 seconds then rinse it off.
Make it fresh daily, and be careful with the peroxide, it will burn your
skin.

Timothy Reeves
ECD Circuit Board Division
13626 South Freeman Road
Mulino, OR 97042
[log in to unmask]
(503) 829-9108 (800) 228-8198  FAX (503) 829-5482



> ----------
> From:         Howard Lin
> Sent:         Wednesday, October 20, 1999 8:05 AM
> Subject:      microsection  procedure for inspecting  ICD
>
> TechNetter,
>  I want to use microsection to check interconection defect (ICD). But I
> have
> no standard procedure to verify this defect. Should I use microetching on
> microsection coupon? Will microetching cause confuse between ICD and
> normal
> interface between electro'less copper and inner layer copper? Is there any
> standard procedure to do microetching? Any input I will be very
> appreciated.
>
> Howard Lin
>

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