Howard
You could use IPC-TM-650 2.1.1 or 2.1.1.2 - These are general automatic
and manual methods.  All of the equipment suppliers have their suggested
way of making a microsection for their equipment and that also can help.

The key is to make certain you have as little smear of copper over the
solder as possible.

Microsections should be evaluated in the as polished condition and after
a microetch.  If you are not familiar with microetching you should do so
very lightly at first with the ultimate goal of being able to see the relative
grain structures of all the types of copper present.  If you do have
separation
you should be able to tell at what location (electroess/foil, electroless/
electrolytic ) it is located.

Etchant is 50/50 3% hydrogen peroxide/ammonium hydroxide.

Email me if you have questions.

Susan Mansilla
Robisan lab

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