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October 1999

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Subject:
microsection procedure for inspecting ICD
From:
Howard Lin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 20 Oct 1999 23:05:35 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
TechNetter,
 I want to use microsection to check interconection defect (ICD). But I have
no standard procedure to verify this defect. Should I use microetching on
microsection coupon? Will microetching cause confuse between ICD and normal
interface between electro'less copper and inner layer copper? Is there any
standard procedure to do microetching? Any input I will be very appreciated.

Howard Lin

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