If you are looking for the area of copper inside a hole, the formula is
3.1416 times the inside diameter times the depth of the hole.  Keep units
consistent. Notice the area decreases as the copper is deposited.  Also note
that sense the flow of the solution is restricted inside the hole, the ion
concentration is reduced so that further reduction of platting inside the
hole occurs.

Sorry if this is overstating the obvious for the old-timers here.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Michael D. Doty
> Sent: Tuesday, October 19, 1999 3:55 PM
> To: [log in to unmask]
> Subject: Re: [TN] ASF info...Super Plater
>
>
>      I'm not sure how you would calculate the ASF in the hole. Getting the
>      area is no problem but from there I have no clue. Also how do oyu
>      figure in the effect of the ground shield or circuits or pads.
>
>      In answering the other part of your question the isolated pad has a
>      much higher current density than the pad in the middle of shielding.
>      This can and will cause plating distribution problems if you're not
>      careful. The isolated pad plates at a higher rate and could burn if
>      the ASF is not controlled properly.
>
>      Mike Doty
>      Hadco TCE
>
>
> ______________________________ Reply Separator
> _________________________________
> Subject: [TN] ASF info...Super Plater
> Author:  Robert Jordan <[log in to unmask]> at smtplink-hadco
> Date:    10/19/99 7:45 AM
>
>
> Hello,
> Once again another question drawing in the vast talent and experience of
> Technet. Is there a way to calculate the ASF inside a through hole in a
> printed circuit board during the electroplate copper process? Is that ASF
> different if the pth is in the middle of a ground plane vs. an isolated
> area? If no formula exists please bend my ear with your opinion.
>
> Thanks,
> Bob Jordan
>
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text
> in
> the body:
> To subscribe:   SUBSCRIBE TECHNET <your full name>
> To unsubscribe:   SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information.
> If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
> 847-509-9700 ext.5365
> ##############################################################
>
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in
> the body:
> To subscribe:   SUBSCRIBE TECHNET <your full name>
> To unsubscribe:   SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information.
> If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
> 847-509-9700 ext.5365
> ##############################################################
>

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################